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2017-01-09

Meyer Burger Ships TFE Thin Film Encapsulation System for OLED Applications to Asian Client

Meyer Burger has shipped a CONx TFE thin film encapsulation system consisting of an inkjet printer and PECVD system to an Asian customer for encapsulation of OLEDs and other flexible electronics applications. This latest order confirms the market’s recognition of Meyer Burger’s integral and fully automated thin film encapsulation system.
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[News] Alternative Technologies to Low-Pressure Germicidal Mercury Lamps for Water Disinfection Applications

The prior blog titled “Nichia’s contribution to a realization of a mercury-free society” took a short break. However, there was a release about new LED-based water disinfection devices made by Miura Co., Ltd., a Japanese manu... READ MORE

[News] Ultra Narrow Beam UV LEDs with Exceptionally Focused 10° Beam for High Intensity and Collimation Applications

Violumas aims to provide the best variety of high-performance UVA, UVB, and UVC LEDs, encapsulated with the highest quality fused silica optics. The wide selection of beam angles (30°, 60°, 90°, 120°, and 135°) allows Violu... READ MORE

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