2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
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Whether in city traffic, on country roads, or off-road, bicycle lights from ams OSRAM (SIX: AMS) reliably ensure visibility and safety. Just in time for the dark season, the new generation of powerful bicycle lighting is here: the innovative L... READ MORE

The way we interact with digital worlds is evolving rapidly, driven by the pursuit of ever more immersive, secure, and sustainable experiences. The latest advances in miniaturization, efficiency, and seamless integration with AR/VR solutions a... READ MORE