2017-11-14

Leti Demonstrates World’s First 300 mm Wafer-to-wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).
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The question of what makes a building "smart" has been debated in the industry for years. ams OSRAM provided a clear answer at Light + Building 2026: it is light — not as illumination, but as a sensory nervous system. It percei... READ MORE

ams OSRAM has entered with its OSRAM brand licensing program into a new partnership for general lighting components. Under the agreement, Eaglerise, a well-established Chinese company, is granted a license under the OSRAM brand for general lig... READ MORE