2018-03-09

Samsung Enhances Chip-Scale LED Package Lineup with Industry’s Highest Luminous Efficacies

Samsung Electronics announced that it has achieved the industry’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup – LM101B, LH181B and LH231B.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE