2018-11-19

Infineon Acquires SiC Wafer Technology Startup Siltectra

Infineon Technologies has announced the acquisition of Siltectra, a Dresden-based start-up which developed an innovative technology, named Cold Split, for processing crystal material. The company was acquired for EUR 124 million (US$141.38 million). With the acquisition, Infineon aims to adopt Cold Split technology to split silicon carbide (SiC) wafers, doubling the number of chips out of one wafer. “This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well. Our system understanding and our unique know how on thin ...
Continue reading
Recently, OMINSU Vietnam signed a strategic agreement with Seoul Semiconductor, marking a pivotal turning point in elevating the “Made in Vietnam” LED lighting brand. At the signing ceremony, Vietnam’s OMINSU and Seoul Semicond... READ MORE
From June 19 to 22, 2025, Samsung Electronics will collaborate with globally renowned artists to celebrate global diversity, artistic innovation and the power of display technology at Art Basel in Basel 2025, the world’s largest art fair he... READ MORE