2018-11-22

ams Works with Qualcomm to Develop 3D Depth Sensing Camera and Debuts Sensor Module for Bezel-Less Smartphones

ams, a high performance sensor solutions provider, has cooperated with Qualcomm Technologies to focus on the development of a 3D depth sensing camera solution for mobile phone applications such as 3D imaging and scanning and biometric face authentication. The two companies aim to dedicate their technology expertise and engineering force to design a 3D stereo camera solution for Android-based mobile phones. ams provides its VCSEL light sources and optical IR pattern technology on the base of Qualcomm’s Snapdragon™ Mobile Platforms to suppourt various applicati...
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE