2019-02-01

Foldable PeLED and 3D Image Sensing Core Chip Developed by Korean Research Teams

Researchers at the Ulsan National Institute of Science and Technology (UNIST) and the Korea Advanced Institute of Science and Technology (KAIST) have achieved new technology developments including foldable flexible perovskite LEDs and a core chip for 3D image sensors respectively, reported BusinessKorea. The research team at UNIST announced that it has developed foldable perovskite LEDs (PeLED) with a transparent material as electrode of the device. PeLED uses perovskite material as light emitting layer through electricity. In the study, resear...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE