2019-02-01

Foldable PeLED and 3D Image Sensing Core Chip Developed by Korean Research Teams

Researchers at the Ulsan National Institute of Science and Technology (UNIST) and the Korea Advanced Institute of Science and Technology (KAIST) have achieved new technology developments including foldable flexible perovskite LEDs and a core chip for 3D image sensors respectively, reported BusinessKorea. The research team at UNIST announced that it has developed foldable perovskite LEDs (PeLED) with a transparent material as electrode of the device. PeLED uses perovskite material as light emitting layer through electricity. In the study, resear...
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The future is right in front of our eyes: lighter, sleeker, and smarter than ever before. Smart glasses is no longer a distant vision; it is on the verge of becoming as natural to us as the smartphone is today. But turning this vision into rea... READ MORE