2022-02-24

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications that offers low-resistance wrap-around wires for seamlessly tiled displays Hsinchu, Taiwan: Bolite Co., Ltd., a laser micromachining subsystem and equipment manufacturer, today announced the Bolite SW-L laser-based, automated side-wiring system, which provides wrap-around wires on the sides of the display panels to connect Micro LEDs to the drive ICs. Supporting various panel sizes and featuring high-precision alignment, advanced process control, and full auto...
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2021-07-05

3D-Micromac Launches A New MicroLED LIFT Mass Transfer Tool

3D-Micromac announced a new microLED mass transfer tool, called microCETI. The company says its new technology can be used to transfer over 130 million microLEDs per hour. <iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture" allowfullscreen="" frameborder="0" height="315" src="https://www.youtube.com/embed/NjYhaYqIp74" title="YouTube video player" width="560"></iframe> MicroCETI is based on a laser-induced forward transfer (LIFT) process that can support almost any microLED material and shape...
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Nichia, the world’s leading global LED manufacturer, will present its most comprehensive portfolio of Pixelated Light Source (PLS) solutions for adaptive driving beam (ADB) headlamps at the International Symposium on Automotive Lighting (IS... READ MORE

The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced... READ MORE