2021-11-22
Realization of side wiring with 10㎛ ultra-fine laser
Solved problems of separation process of the glass substrate.
Shorten 3D pattern printing process to 50 to 5 minutes
<Laser apps' self-developed microLED side wiring laser equipment>
A small and medium-sized company has developed a core process technology for the next-generation microLED display that will succeed the organic light emitting diode (OLED). It is an ultra-fine laser technology necessary to implement wiring on the side of a thin glass substrate, and is expected to increase the yield of micro ...
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