Realization of side wiring with 10㎛ ultra-fine laser Solved problems of separation process of the glass substrate. Shorten 3D pattern printing process to 50 to 5 minutes <Laser apps' self-developed microLED side wiring laser equipment> A small and medium-sized company has developed a core process technology for the next-generation microLED display that will succeed the organic light emitting diode (OLED). It is an ultra-fine laser technology necessary to implement wiring on the side of a thin glass substrate, and is expected to increase the yield of micro ...