2022-03-09

Avicena Demonstrates Record-Breaking Ultra-Low-Energy Optical Chip-to-Chip Interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density. CMOS wafer with transferred microLEDs (Photo: Business Wire) SAN DIEGO, March 07, 2022--(BUSINESS WIRE)--AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle™ multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA (https://www.ofcconference.org/en-us/home/...
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The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE