2022-03-09

Avicena Demonstrates Record-Breaking Ultra-Low-Energy Optical Chip-to-Chip Interconnect

Avicena partners with Lumileds to demonstrate microLED-based LightBundle™ chip-to-chip interconnects with superior energy efficiency and bandwidth density. CMOS wafer with transferred microLEDs (Photo: Business Wire) SAN DIEGO, March 07, 2022--(BUSINESS WIRE)--AvicenaTech Corp., a privately held company in Mountain View, CA, is demonstrating its LightBundle™ multi-Tbps chip-to-chip interconnect technology at the Optical Fiber Communications (OFC) Conference in San Diego, CA (https://www.ofcconference.org/en-us/home/...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE