2022-11-14

Factors Affecting the Printing Quality of Mini LED Solder Paste

With the increasing improvement of process and equipment accuracy of major packaging plants, the chip size of Mini LED applications has gradually evolved from 5x9mil to today's 3x5mil, even smaller. The reduction of chip size means that more LED chips can be arranged in the same unit area of display  or backlight unit, and higher requirements are put forward for chip mounting. At the same time, higher requirements are put forward for chip mounting.   First of all, the most significant change is that the pad size of the PCB becomes smaller, and the correspondin...
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE