Competition in glass substrate-based advanced packaging is intensifying across the semiconductor industry. According to Central News Agency, China is accelerating investment in glass substrate-based advanced packaging, while Taiwan is stepping up efforts to strengthen its competitiveness by integrating its semiconductor, optoelectronics, and equipment manufacturing capabilities. Intel and China’s Lens Technology announced a strategic collaboration to advance glass substrate-based semiconductor packaging. Institutional investors cited by the report say the partnership ...

On July 3, BOE disclosed its latest investor relations update, outlining recent progress in optical interconnects, glass core substrates, perovskites, as well as its LCD and OLED businesses. Optical interconnect is one of BOE’s key strategic focus sector. The company said it plans to give full play to its long-standing expertise in display technologies, glass processing, and large-scale intelligent manufacturing to advance optical interconnect and glass-substrate co-packaged optics (CPO) technologies. To accelerate development, BOE has established dedic...

On March 19, BOE HC Semi’s Micro LED factory, the world’s first 6-inch Micro LED mass production line, held its product delivery ceremony in Jinwan District, Zhuhai. During the ceremony, BOE HC Semi unveiled its latest Micro LED products and officially delivered Chip on Wafer (COW) and Micro Pixel Display (MPD) products to customers. According to available information, the BOE HC Semi Micro LED factory was invested in and built by BOE HC Semi Optoelectronics (Guangdong) Co., Ltd. The factory commenced constructi...