As parameter counts in generative AI models expand exponentially, single-GPU configurations can no longer meet processing demands. While clustered computing has become industry standard, it introduces severe physical limits: the Bandwidth Wall and the Power Wall. In modern AI server architectures—specifically within chip-to-chip (Die-to-Die) and board-to-board Scale-Up expansion topologies—traditional copper interconnects are rapidly hitting physical ceilings. Signal attenuation, elevated latency, and unsustainable power dissipation have sparked a clear cons...