Hi, https://test.trendforce.com/member/personal Member Center | Contact Us RSS facebook google+ twitter linkedin mobile web     CN TW EN

Home > QFN
2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
Continue reading →
FEATURED PRODUCTS
[News] Achieved a World-leading WPE of 7.5% through Approximately Threefold Improvement in the Emission Efficiency of 265nm UV-C LEDs

Stanley Electric Co., Ltd. (Head Office: 2-9-13 Nakameguro, Meguro-ku, Tokyo; President and CEO: Yasuaki Kaizumi) has significantly improved the emission efficiency of its UV-C LEDs at a wavelength of 265nm—widely recognized as the most ... READ MORE

[News] Expanding the Applications of Hortisolis™ LEDs Beyond Artificial Farms

Nichia, the world's largest LED / Laser Diode manufacturer and inventor of the high-brightness blue and white LEDs, has confirmed a reduction in product waste and an increase in sales through a pilot test conducted in a retail garden cente... READ MORE

PRESS RELEASE