2009-07-09

QFN Packaging Solves The Heat Dissipation Problem of LED Display

QFN Packaging Solves The Heat Dissipation Problem of LED Display Currently, almost all LED display manufacturers face the problem of heat dissipation during PCB design, with the thermal effect of drivers disturbing the normal light emitting property of LED and further influencing the color uniformity of the overall display. This article will illustrate how headaches can be prevented by changing the packaging of driving chips.
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From June 10 to 12 in Amsterdam, GreenTech visitors can explore how the latest-generation LED and sensor solutions from ams OSRAM enhance plant growth, save energy, and promote sustainable farming. At Hall 05, Booth 05.357, attendees will expe... READ MORE

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