2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
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Recently, OMINSU Vietnam signed a strategic agreement with Seoul Semiconductor, marking a pivotal turning point in elevating the “Made in Vietnam” LED lighting brand. At the signing ceremony, Vietnam’s OMINSU and Seoul Semicond... READ MORE
From June 19 to 22, 2025, Samsung Electronics will collaborate with globally renowned artists to celebrate global diversity, artistic innovation and the power of display technology at Art Basel in Basel 2025, the world’s largest art fair he... READ MORE