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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
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[News] VueReal Expands Reference Design Kit Portfolio with Industry-Specific Bundles to Accelerate MicroLED Commercialization

VueReal, the pioneer of MicroSolid Printing™, today announced a significant expansion of its Reference Design Kit (RDK) portfolio with new industry-specific bundles. Purpose-built for automotive and consumer electronics, the vertical RDK... READ MORE

[News] ViewSonic Launches Second Generation All-in-One, Mobile, Direct View LED Display Solution Kit

ViewSonic Corp., a leading global provider of visual and edtech solutions, announces the shipping of LDS138-151, a 138-inch all-in-one, mobile Direct View LED Display Solution Kit. The ViewSonic LDS138-151 is a fully pre-assembled kit that bui... READ MORE

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