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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
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[News] Aledia to Showcase Cutting-Edge MicroLED Innovations at Touch Taiwan 2025

Aledia, a global European leader in nanowire and 3D silicon-based microLED technology for next-generation displays is pleased to announce its participation in Touch Taiwan 2025, the leading display industry event, taking place from April 16 to... READ MORE

[News] Unlocking Safety and New Horizons with EVIYOS™ Shape

In a rapidly evolving world, safety and innovation are key factors that transform interactions with our surroundings. ams OSRAM (SIX: AMS), a global leader in intelligent sensors and emitters, is at the forefront of this evolution, delivering ... READ MORE

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