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2009-10-26

Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks.
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2009-10-20

Nuventix Launches More Compact SynJet Cooler for Philips Fortimo LED Downlight Module

Nuventix, Inc., innovator of SynJet active thermal management solutions, today announced the general availability of the next generation of the SynJet Universal DLM Cooler for the Philips Fortimo LED Downlight Module (DLM). The introduction of the 120mm compact SynJet cooler announcement caps a successful 2009 for Nuventix by delivering the smallest thermal solution available for the Philips Fortimo DLM.
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[Product News] Macroblock to Drive Advances: Captivate ISE 2025 with Groundbreaking Flagship DaVinci Series LED Driver ICs

ISE 2025, the largest European system integration trade show, marks a significant highlight for the LED display industry at the start of the year. Macroblock is excited to debut a new series of products and collaborate with industry leaders su... READ MORE

[News] ViewSonic Unveils Pioneering Control Box Designs for Seamless Large Display Adoption at ISE 2025

ViewSonic Corp., a leading global provider of visual solutions, is unveiling the world's first rack-mount All-in-One control box (LD-SCB-023) at Integrated Systems Europe (ISE) 2025. Seamlessly integrating power and control systems, the LD... READ MORE

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