2011-12-01

ASMPT CEO W. K. Lee: SIPLACE integration is making good progress From wafer to SMT placement: SIPLACE parent ASMPT offers a wide range of solutions for the electronics industry

On the occasion of the SIPLACE press conference for the upcoming Productronica trade show in Munich, W. K. Lee, CEO of ASM Pacific Technology (ASMPT), pointed out that the ASM Group is now the supplier with the widest-ranging technology and product portfolio for the electronics industry. ASMPT is the only equipment manufacturer in the world that integrates solutions for all process stages from front-end (wafer design and production) to back-end assembly (chip packaging, bonding, etc.) to SMT placement solutions provided by the SIPLACE team. W. K...
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2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
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Signify, the world leader in lighting, has been awarded the Platinum sustainability rating from EcoVadis, underscoring its consistent leadership in sustainability. The ranking places Signify among the top 1% of companies evaluated worldwide. W... READ MORE

Aledia, the leader in nanowire and 3D silicon-based microLED display technology, is proud to announce it is a winner in the Computing, Chips, and Foundational Technology category in Fast Company’s Next Big Things in Tech list. This prest... READ MORE