2011-12-01

ASMPT CEO W. K. Lee: SIPLACE integration is making good progress From wafer to SMT placement: SIPLACE parent ASMPT offers a wide range of solutions for the electronics industry

On the occasion of the SIPLACE press conference for the upcoming Productronica trade show in Munich, W. K. Lee, CEO of ASM Pacific Technology (ASMPT), pointed out that the ASM Group is now the supplier with the widest-ranging technology and product portfolio for the electronics industry. ASMPT is the only equipment manufacturer in the world that integrates solutions for all process stages from front-end (wafer design and production) to back-end assembly (chip packaging, bonding, etc.) to SMT placement solutions provided by the SIPLACE team. W. K...
Continue reading
2011-12-01

SIPLACE Press Conference:SIPLACE team well-positioned for the future of electronics production

Good news from the management of ASM Assembly Systems GmbH & Co. KG (formerly Siemens Electronics Assembly Systems) at the SIPLACE press conference in Shenzhen. SIPLACE COO in China, Herbert Hofmann, presented a whole series off innovative SIPLACE solutions for the following process steps: new product introduction (NPI), setup changeover and production run. Based on the globally leading SIPLACE placement platform, integrated hardware, software and service innovation will help especially electronics manufacturers in China and Asia to...
Continue reading
XLamp® CTW LEDs bring lighting flexibility to life New XLamp® CTW Series – Two-Channel CCT-Tunable White COB LEDs Cree LED’s XLamp CTW Series redefines CCT-tunable COB LEDs with unmatched lumen density, efficiency and de... READ MORE
ams OSRAM, a global leader in innovative light and sensor solutions today held a roundtable forum spotlighting new opportunities with high precision illumination characterization. The event brought together experts from industry, academia, and... READ MORE