2013-05-16
Verticle Inc. extends its product line to UV LED. A new hexagonal shaped UV chip is made out of copper substrate enable to drive high current. Despite its numerous advantages, the main drawback of UV LED is lower optical power due to lower internal quantum efficiency (IQE). Since improving the IQE of UV epitaxial wafers is a long-term prospect, an alternative way to boost UV LED power is to drive more current into the UV-LEDs. However, heat generation is a big issue with high current drive. Moreover, aluminum containing UV epitaxial wafer is more res...
Continue reading →
2012-02-13
Verticle, Inc. is to start mass production of a hexagonal-shaped "Honeycomb" LED chip. The chip will be showcased and available for sale at LED China 2012 between 20 and 23 Feb 2012 in Guangzhou. According to Mike (M.C.) Yoo, Verticle's CEO," This vertically structured LED chip features significant benefits that include higher light extraction and amore uniform beam profile than conventional square or rectangular LED chips based on sapphire or silicon substrates." Firstly, Honeycomb delivers an improvement in diode performance when...
Continue reading →