Bridgelux, a leading developer and manufacturer of LED lighting technologies, is introducing its EB Series platform of surface mount devices (SMDs) mounted on linear printed circuit boards.

The Module-Driver Interface Special Interest Group (MD-SIG), a lighting-industry consortium, has published its LEDset specifications. LEDset provides the lighting market with a standardized, multi-vendor, electrical interface for LED systems, which simplifies the process of matching LED modules with suitable drivers.

Everlight Electronics, a leading player in the global LED and optoelectronics industry, will be introducing diversified LED packages at the Guangzhou International Lighting Exhibition 2015 (6/9-6/12, booth: 10.2 B02), including XI7070W, G9 package series, UV LED, automotive, sensing applications, Hong series with superior waterproof and UV resistant components for signage, brightness- and efficiency-enhanced LED package offering for a wide range of applications. EVERLIGHT is sincerely welcome you to experience EVERLIGHT one stop total solution at the show.

In Part II of our series on Solutions for Today’s Low Power LED Lighting Trends we listed the many regulatory and industry standards that designers need to account for in order to understand the design constraints of any given project for reducing power losses, power factor correction and low THD in the LED driver. In addition to the regulations and standards discussed, there are a number of other factors that need to be considered that can impact design. These include:

Chinese LED manufacturer Silan Microelectronics (Silan) recently announced net profits soared in 2014 by 30% to 50% compared to the same period in 2013.

Flip Chip Opto, a LED lighting technology company, announced its new P Series of LED Flip Chip Chip-on-Board (COB) products. These high-performance lighting modules are comprised of patented 3-Pad LED flip chips with a Pillar Metal Core Printed Circuit Board (P-MCPCB) to substantially reduce junction temperatures, thermal decay and light emitting surface (LES). Our innovation enables designers to enhance “Lumen-per-Dollar” performance by driving the modules at substantially higher currents reducing LED chip counts, heatsinks and optics.

Molex Incorporated announced today that its first SlimRay™ Pre Wired LED Chip-On-Board (COB) Array Holders reduce assembly time while increasing reliability, with compression contacts that eliminate hand soldering and simplify the LED installation process. The holder for 13.35 by 13.35mm COBs comes as a single piece in a 25.0mm diameter, low 3.15mm profile height, rated at 300 volts DC and 3.0 amps. 

LED EPI wafer and chip manufacturer Genesis Photonics Inc. (GPI) Chairman David Chung upheld a positive outlook for the flip chip industry at a company shareholders meeting on June 18, 2014.

On July 30, Philips Lumileds announced signing distribution agreements with Macnica/Clavis Company and Marubeni Metals in Japan, in order to expand product availability and speed time-to-market of LED lighting solutions. The two new agreements enable immediate access to Philips Lumileds application-specific LEDs in Japan. "Our new distribution partners will have full access to the products, services and people at Philips Lumileds," said Pierre-Yves Lesaicherre, CEO Philips Lumileds. "Macnica/Clavis Company and Marubeni Metals are now able...

With the different requires for different applications, EVERLIGHT represents the new series LED components to bring customers the concept of “The Right LED for the Right Application.” EVERLIGHT ELECTRONICS CO., LTD. 【TSE:2393】, a leading player in the global LED industry, represents brand new series of LED components at 2013 Lighting Japan. This year, EVERLIGHT showcases the most updating series of high efficient and brightness LED packages for general lighting, automotive and infrared sensor applications....