Taiwanese LED chip manufacturer, Epistar, recently showcased its latest Embedded LED Chip (ELC) technology. The new ELC product reduces lead frame and wire bonding, and only requires a chip, phosphor and glue, said Hsieh Ming-Hsun, VP, R&D, Epistar at the LED Technology Forum held in Taipei, Taiwan. As a result, the chip can directly use surface-mount technology (SMT). The ELC can be applied in advance onto backlight products, and possess advantages of wide light beam angles, continued Hsieh. There is an opportunity to omit secondary optical lenses in the future.