2013-11-06

Low Price Trend Leads to Surge in Package Free Technology

With the continual low price trend of  in the LED market, manufacturers are beginning to consider options for lowering productions costs. LED package free products have become the focal point of the industry in 2013 with many manufacturers actively breaking into R&D and production.
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2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
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Samsung today announced a new edition of its large-format LED display, The Wall, marking a pivotal expansion to its Chip on Board (CoB) lineup. Like earlier models of The Wall, the MPF series optimizes viewing experiences across an array of en... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of Illinois against Promier Products and Tractor Supply. The laws... READ MORE