2013-11-06

Low Price Trend Leads to Surge in Package Free Technology

With the continual low price trend of  in the LED market, manufacturers are beginning to consider options for lowering productions costs. LED package free products have become the focal point of the industry in 2013 with many manufacturers actively breaking into R&D and production.
Continue reading
2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
Continue reading

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE