2013-11-06

Low Price Trend Leads to Surge in Package Free Technology

With the continual low price trend of  in the LED market, manufacturers are beginning to consider options for lowering productions costs. LED package free products have become the focal point of the industry in 2013 with many manufacturers actively breaking into R&D and production.
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2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE