On September 5, 14:00 - 14:30, Universal Instruments’ Advanced Process Lab (APL) presented Assembly Solutions for Wide IO Package-on-Package Applications at the SEMICON Taiwan TechXPOT. The presentation explored Package-on-Package (PoP), or processor-memory stacking, as solutions to increasing performance in a smaller form factor for mobile computing and other applications.

“As 2.5D and 3D technologies are becoming more prevalent, manufacturers are being confronted with evolving challenges, including new materials and complex processes,” said David Vicari, APL Director. “This is where the APL can play an integral role by partnering from prototyping and development to first article build, NPI, and volume production. By leveraging the knowledge of our expert team and our specialized precision analytical tool set, we help manufacturers maximize product yield and long-term reliability,” he added.

For leading-edge applications, the equipment solution must also be up to the challenge. Universal’s GenesisSC™ delivers high-end performance with 10µm accuracy, 3µm placement repeatability, and unmatched throughput. GenesisSC easily manages diverse packaging and assembly requirements by handling the broadest range of die and components, substrate types and sizes, and supporting a full array of feeder types and configurations.

In addition to the TechXPOT presentation, Universal also hosted two half-day informative technology sessions – Universal Instruments Meet the Experts: Discussions on the Challenges of Advanced Packaging – in Room #441 on Wednesday, September 4 (13:00 - 17:00) and Thursday, September 5 (8:00 - 12:00).