Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week.

G9 LED bulb specs.

Introducing PEC and HV LED technology into the G9 capsules helps to resolve heat dissipation problems. Luminous efficacy is 70lm/w with flux of 200lm and CRI of 80. PEC has a high package density and driver power. It is suitable for introduction into next generation lighting. PEC does not require wire bonding, has low thermal resistance, and fast thermal conductivity, said Epistar. It is able to support high voltage currents and over-drive.

G9 LED bulbs in action at Epistar's booth at TILS 2014 last week.

G9 LED bulbs on the market only reach 100 lumens, but Epistar has developed products that reach 200lm especially for their clients.

In the past, LED manufacturers tend to have heat dissipation problems when using G9 bulb applications. Use of PEC technology lowers interface thermal resistance and increases speed of thermal conductivity. In addition, increased HV LEDs efficacy allows G9 bulbs to reach higher luminosity and solve heat dissipation problems.

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