2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
Continue reading

Cree LED®, a Penguin Solutions brand (Nasdaq: PENG), today announced its new XLamp® XE-B LEDs, extending the industry-leading XLamp Element family into an even smaller form factor to enable new levels of design flexibility and performa... READ MORE

Seoul Semiconductor Co., Ltd., a global opto-semiconductor technology company, announced today that its world's first High Voltage (HV) opto-semiconductor technology has entered mass production with four of the world's top automotive b... READ MORE