2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of Georgia against NanoLumens, Inc. The lawsuit asserts that Nano... READ MORE

WG Tech recently held an in-depth online discussion with Dr. Adi Abileah, former Chief Scientist at Planar Systems and a SID Fellow, to exchange insights on glass substrate based MiniLED technology innovation. Dr. Abileah, a globally respected... READ MORE