2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
Continue reading

LEDVANCE is proud to announce that three of its most innovative lighting solutions have won recognition in the 2025 Illuminating Engineering Society (IES) Progress Report, a prestigious annual showcase of advancements in lighting technology. T... READ MORE

XLamp® CTW LEDs bring lighting flexibility to life New XLamp® CTW Series – Two-Channel CCT-Tunable White COB LEDs Cree LED’s XLamp CTW Series redefines CCT-tunable COB LEDs with unmatched lumen density, efficiency and de... READ MORE