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2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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[News] 3Particle Joins Forces with Shineon Hardtech, Macroblock, and Brompton to Launch XyperReal Stage, Asia Premium Virtual Production Research & Innovation Centre

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