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2014-03-25

Epistar Develops G9 Technology to Eliminate Heat Dissipation Issues

The pace in which flip-chips are integrated into lighting and backlighting products in 2014 has drawn the attention from the industry. LED package manufacturer Epistar showcased their new G9 capsules which use Pad Extension Chip (PEC) and HV LED technology during the Taiwan International Lighting Show (TILS) 2014 last week. 
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[News] Alternative Technologies to Low-Pressure Germicidal Mercury Lamps for Water Disinfection Applications

The prior blog titled “Nichia’s contribution to a realization of a mercury-free society” took a short break. However, there was a release about new LED-based water disinfection devices made by Miura Co., Ltd., a Japanese manu... READ MORE

[News] Ultra Narrow Beam UV LEDs with Exceptionally Focused 10° Beam for High Intensity and Collimation Applications

Violumas aims to provide the best variety of high-performance UVA, UVB, and UVC LEDs, encapsulated with the highest quality fused silica optics. The wide selection of beam angles (30°, 60°, 90°, 120°, and 135°) allows Violu... READ MORE

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