With the continuous upgrading of MiniLED industry, the market trend has gradually become clear. With the steady development of backlight TV and laptop display applications, the continuous innovation of small-size VR display technology, and the growing demand for intelligent EV, MiniLED backlights have become more and more popular in the market.
Jufeng, a leading semiconductor soldering and electronic packaging material solution provider since 2006, recently released its ultra-fine size solder paste solution JF-ML100, which can be widely used in different applications.
Jufeng was established in September 2006. The company is complied with IATF16949 and ISO9001:2015 certification. As a national high-tech enterprise and a member of IPC Association, Jufeng focuses on the field of electronic packaging materials. The main products are different types of solder wire, low temperature solder wire, ultra-fine solder wire, solder bar, solder paste, solder preform, Low Alpha solder ball and other products.
As the size of Mini LED chips is getting smaller, the packaging process has higher requirements for soldering material. JF-ML100, the Mini LED solder paste solution launched by Jufeng this time aims to provide better workability for the packaging process, while ensuring better performance and higher reliability.
JF-ML100 is a lead-free die-bond solder paste suitable for Mini LED printing process. Using unique flux formulation technology and ultra-fine solder powder, it has a wide process window and excellent product stability, also has great performance in different applications.
Features
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Solder powder has high sphericity & concentrated particle size
Solder powder
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Longer stencil printing life >10h
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High shear strength
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Low voiding
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Less & transparent flux residue
For more information about Jufeng Mini LED solder paste products, please contact us now:
Shenzhen Jufeng Solder Co.,Ltd
Address: 12# Jinpeng Industry Area, Jihua Road, Buji Town, Longgan District, Shenzhen, China
TEL: +86-13622394561
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