
Apple is expected to launch its first foldable smartphone in 2026, and competition among potential component suppliers is already intensifying. According to Patently Apple, which cited a well-known analyst, Samsung Display is likely to supply a crease-free display solution for the device. Meanwhile, Sisa Journal points to several companies as potential hinge suppliers.
As noted by the report, if Apple confirms a foldable launch in the second half of next year, its hinge supply chain management framework could take shape as early as late 2025 or early 2026. Sisa Journal highlights U.S.-based Amphenol, China’s Dongguan Iontec, and Korea’s FineMec as contenders to supply hinges for Apple’s first foldable iPhone.
Among them, South Korea’s FineMec is emerging as a strong candidate to supply the internal hinge (backplate), which connects to the display panel, for Apple’s foldable iPhone, according to Sisa Journal. The internal hinge, according to the report, plays a crucial role in minimizing screen creases when the device is unfolded.
Notably, FineMec, already a key supplier for Samsung’s foldables, has expanded from internal to external hinges starting with Samsung’s sixth-generation models, as per Sisa Journal. The company supplies components to Samsung Display, which then integrates them into Samsung Electronics’ foldable phones, the report notes.
On the other hand, the report also suggests that U.S.-based Amphenol and Taiwan’s Shin Zu Shing have developed waterdrop-style hinges, and are now providing them to Chinese smartphone makers. In addition, China’s Dongguan Iontec is also seen as a strong candidate to supply Apple’s foldable iPhone, thanks to its new molding technology using liquid metal, the report adds.
TrendForce’s latest investigations reveal that the anticipated launch of Apple’s first foldable device in the second half of 2026 is expected to lift foldable phone penetration from 1.6% in 2025 to over 3% in 2027. According to TrendForce, the global foldable hinge market is projected to reach US$1.2 billion in 2025, with hinges currently accounting for about 5–8% of the BOM cost per device.
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