Plessey Semiconductors has reported its partnership with Jasper Display Corp (JDC) for using JDC’s silicon backplane to drive the monolithic Micro LED displays produced by Plessey’s proprietary GaN-on-Si wafers.

(Image: Plessey)

Plessey will utilize JDC’s eSP70 silicon backplane, which is tailored for the needs of Micro LED devicesm, and features a resolution of 1920x1080 and pixel pitch of 8µm. The full color capable active matrix backplane offers excellent current uniformity via a proprietary current source pixel as well as flexible addressing. JDC unveiled the backplane at CES in Las Vegas in January 2018.

According to Plessey, JDC’s eSP70 backplane will allow Plessey to flexibly use its GaN-on-Si platform for Micro LEDs to deliver very high brightness with moderate power consumption or daylight usable brightness with low power consumption.

Dr. Keith Strickland, CTO of Plessey, said, “JDC’s Micro LED specific silicon backplane allows Plessey to rapidly bring to market our monolithic full color Micro LED array at our entry level 8µm pixel size. At Plessey, we have overcome the significant challenges involved in accurately aligning and bonding the Micro LED array with the backplane. We are looking forward to partnering with JDC as we continue our development, reducing pixel and display size.”