LEDinside, a research division of TrendForce, jointly organized "LEDforum 2013 China International LED market trend Summit Forum" with Guangzhou International Lighting Exhibition. The LEDforum 2013 was grandly opened at the Chinese Export Commodities Fair Pazhou Complex, Area B, Room #8 on June 11, 2013. Many distinguished guests from LED industry participated in this forum, and there were more than one thousand of attendees, which is unprecedented, and thus it is obvious that this forum occupies a significant position in the LED industry.

LEDforum 2013 themed the market trends and development strategy of the LED industry, and guests actively analyzed the pulse and opportunities of the LED market. LEDinside edited some scene trailers to share the best moments of LEDforum 2013.

Sean Zhou from Philips Lumileds: the further evolution of LED is optimistic; LED lighting is expected to realize a great change in pattern after five years.

Yongliang Xu from YUNFNG GROUP: the road for Sapphire Substrate enterprises to break through is the emerging of non-LED market, such as the application in smart phones, military window, SOS and other segments, which will reinvigorate the sapphire industry, but technological breakthroughs as well as cost control still faces challenges.

Mark Mckee from Veeco: unlocks the potential of solid-state lighting through the technology innovation in MOCVD.

Francis Jen from KLA-Tencor: process control can improve the yield management in LED manufacturing. Leading technology is the key to improve the return on investment (ROI), while the technical deficiencies in base material, the epitaxial process and patterning processes will affect the yield.

Dr. Yao Chiu Lin from Epistar: the penetration of LED will reach 50% of the traditional light sources by 2015. Chip and and packaging for TV backlight will be more extensively available in the lighting market.

Robin Liao of Richtek: design of international power management IC would be one of the important factors affecting LED lighting driving modules.

Tie Lin from Cree: introduced the latest packaging technology development of lighting LED, Tie Lin discussed how to develop better LED components from technical level.

Qian Wu from Honglitronic: indoor lighting will develop toward intelligentization, humanization and diversification.

Weibin Gong from Refond: Made a speech titled "New LED packaging technology based on IC packaging". He believes that the ratio between chip area and packaging area will be more close to 1; it is likely to develop free package in the future.

Roger Chu from LEDinside: reviews and prospects of LED Industry were conducted in his speech. He thinks that it is very difficult to overcome the oversupply in short time.

Figo Wang from LEDinside: over the past few years, China LED lighting market has achieved rapid growth under the active promotion of policy, and the comprehensive replacement of LED lamps will be the main engine of the growth in market demand for LED lighting in the future. But Chinese consumers' low awareness of LED lamps is still the primary obstacle to the popularity of LED, according to survey jointly conducted by LEDinside and AVANTI, only 25% of Chinese consumers can correctly identify LED lamps.