Comparing to CES, NEPCON is more a low-key show focusing more on the technology communication rather than media exposure. The event style also reflected on how Micro LED technology was presented in the two shows.

At NEPCON Japan, even though Micro LED and Mini LED displays are not as highlighted as they were at CES 2020, LEDinside still saw some Japan based exhibitors introducing their proprietary technologies covering mass transferring and inspection. These equipment makers offer mass production solutions for Micro LED displays, which are right at the corner of commercialization.

Shin-Etsu demonstrated its Micro LED transfer solution. Micro LED wafers are put on the company’s donor plates for laser lift-off process with LED chips transferred to the donor plate and sapphire substrate removed. Following was the Ga cleaning process. Afterward, Shin-Etsu’s EZ-PETAMP is used to transfer Micro LED chips to display backplanes. The solution can be used in flip-chip technology and third generation can process with 4-inch wafer.

Micro LED transfer, inspection and repair solution provider Toray also joined NEPCON this year. The company uses camera to find defects on LED chips and remove them with laser. Then its equipment can precisely locate RGB LED for chip transfer. The whole process will run again to check and repair for improving production yield.

TDK posted its Micro LED solution at its booth as well. Its solution offers Micro LED defect removal, inspection, repair, mass transfer, and backplane connection. TDK can transfer big amount of Micro LED in 10µm with an accuracy of ±1.9µm.