2015-05-12

Alpha to Present Paper on LED Die Attach Technologies at GILE 2015

Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on LED die attach technologies at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th – 12th in China.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE