Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on LED die attach technologies at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9^th – 12^th in China.

The paper, titled LED Die Attach Technologies – Trends and Considerations will focus on the key role die-attach materials play in the performance and reliability of mid-power to super-high power LEDs.  The presentation will provide an overview of different die attach technology platforms and discuss their key attributes and fit with different chip structures operating at different power levels.

Alpha logo. (Alpha/LEDinside)

“The selection of the die-attach material for a particular chip structure and application depends on several considerations that include process, reliability, performance and of course cost” said Gyan Dutt, LED Technical Marketing Manager for Alpha.  “I look forward to providing my view on die-attach selection and package assembly process in view of the rapidly increasing adoption of flip-chip on board and chip-on-board (COB) applications.”

During the lighting exhibition, Alpha will exhibit its LED compatible sintered die attach, conductive adhesives and solder assembly bonding materials at Booth # 11.2 B18. Encompassing a comprehensive product line for LED applications, Alpha offers an efficient and reliable solution for every bonding event throughout your assembly process from Die Attach & Package, Package on Board, Luminaire Module, to Power Driver/Supply and Control Systems.

To learn more about Alpha and our LED Technologies, please visit our site.

GILE (Guangzhou International Lighting Exhibition)

Date: June 9-12, 2015

Venue: China Import and Export Fair Complex, Guangzhou, China

Visit Alpha at Booth # 11.2 B18