2016-03-15

Samsung Expands Product Portfolio with New Line-up of CSP LED Packages

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
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Aledia, the leader in nanowire and 3D silicon-based microLED display technology, is proud to announce it is a winner in the Computing, Chips, and Foundational Technology category in Fast Company’s Next Big Things in Tech list. This prest... READ MORE

Wearables are evolving into everyday health companions. To reliably capture vital signs such as blood oxygen saturation (SpO₂) with in-ear or other compact wearable devices, optical components are required that take minimal space while deliver... READ MORE