2022-02-24

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications

Bolite Unveils Laser-based Side-wiring Solution for Panel-tiling and Thin Bezel Display Applications that offers low-resistance wrap-around wires for seamlessly tiled displays Hsinchu, Taiwan: Bolite Co., Ltd., a laser micromachining subsystem and equipment manufacturer, today announced the Bolite SW-L laser-based, automated side-wiring system, which provides wrap-around wires on the sides of the display panels to connect Micro LEDs to the drive ICs. Supporting various panel sizes and featuring high-precision alignment, advanced process control, and full auto...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE