Taiwan LED chip manufacturer Genesis actively developed flip chip technology this year. Taking advantage of flip chip technology to propel development of high voltage and high powered LEDs in order to break into Japanese brand named smartphone manufacturers’ flash supply chain.
The TMF8829 direct Time-of-Flight (dToF) sensor significantly increases resolution — from the previously common 8×8 zones to 48×32 — and it is designed to detect subtle spatial differences and distinguish closely spaced... READ
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Introducing the New J Series® 3030S 3V & 6V LEDs
Cree LED is expanding the proven J Series 3030 portfolio with four new high-performance LEDs that combine a 757-footprint with outstanding efficacy and drop-in compatibility with popula... READ
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