Lumens to Introduce 200 l/w Flip-Chip Mid-Power Package

Lumens, a Korean LED packaging manufacturer, introduces new Mid-Power LED 5630F, a new family of Ergon^TM. Based on Lumens’ Flip Chip technology, the new 5630F4 provides the superb reliability to the conventional LED components while delivering the highest efficacy up to 200lumens-per-watt at 65mA, 5000K CCT, 80 CRI. Thanks to the world’s first silver-free flip chip technology, the new 5630F provides higher Reflectivity and Robustness. The 5630F also features high color uniformity with 3-step MacAdam Ellipses and Excellent light quality.

“Lumens is the world’s first company that introduced the form factor of 5.6x3.0 millimeters package. Now we’re very excited that we can show another world’s first innovation to the customers. ” said Danny Noh, a strategic marketing VP.

Lumens will launch 5630F4 officially on coming Lighting Fair Japan 2015 in Tokyo from Mar 3, 2015 to Mar 6, 2015. Lumens attends the fair through Lumens Japan, a Japan branch of Lumens. Please visit Lumens at Booth #LF2030, West hall.

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