Taiwanese LED manufacturer Genesis Photonics Inc. (GPI) has been developing flip chip LEDs for a long time, since 2015 the company released its flip chip integrated high power light source solution last year at Taipei AMPA 2015, which received positive feedback from the industry. In 2016, the company launched an innovative CSP components at LIGHTING JAPAN 2016 that are thinner with higher lumen per watt, enabling ultra- high efficacy of (>200 lm/W), aiming for supplying portable electronics backlights and automotive light source market (TS16949 certified) that requires high reliability.

LEDinside visited the booth, designed and organized by the company’s Japanese branch at LIGHTING JAPAN 2016, and found the booth quality and design matched other Japanese manufacturers. It was one of the best presented booths among Taiwanese manufacturers. The company focuses on promoting its smaller CSP products at the exhibition.

The exibiiton booth of GPI at Lighting Japan 2016. (All photos courtesy of LEDinside)

Building on their flip chip LED product foundation, GPI released a 10W high power CSP component with 200 lm/W. Considering the market demands for smaller light sources, GPI launched ZA3-3K, a single-chip 10W 3535 CSP flip- chip LED component, free from the 1-5W limitations of previous 3535 components, which is also a breakthrough compared to regular components. Meanwhile, to meet the market’s efficacy expectation, GPI launched the world’s smallest 2020 CSP flip chip LED component WA20-3T, which outwins the existing 3030 or 5630 components, and is internationally the smallest LED component to achieve an efficacy of 200lm/W. In other words, the luminous density (lm/mm²) of this component even outperformed Japanese, European and U.S. manufacturers.

ZA3-3K (left), a single-chip 10W 3535 CSP flip- chip LED component, free from the 1-5W limitations of previous 3535 components. WA20-3T (right), the world’s smallest 2020 CSP flip chip LED component.

Ultra- thin 1mm CSP flip chip LED component for TV backlight

Following the development of thinner portable electronic display devices, GPI utilizes its advantage in smaller size R&D to provide higher output compared to Plastic Leaded Chip Carrier (PLCC). GPI separately released the thinnest 0.3mm mobile back light component with side view CSP WAS2003, and the thinnest edge view TV back light WAE1810 with flip chip CSP component. The TV backlight module is only 1mm thick, the chip’s power was raised to 1W and light emitting angle more than 130°, which provides thinner and brighter next generation solutions compared to existing 4014 components with 1.4mm, 0.5W and 120° beam angle.

The thinnest 0.3mm mobile back light component with side view CSP WAS2003 (left), and the thinnest edge view TV back light WAE1810 with flip chip CSP component (right).

GPI LED light source enters automotive aftermarket in U.S. and Japan

Wire bonding-free, tight assembly, low thermal resistance and high efficacy are the main features of flip chip LEDs. Developments in automotive lighting market in recent years and R&D collaborations with automotive modular manufacturers, GPI has completed the full range of products from single chip to multi- chip CSP product range, providing clients with flexible and full range options.

GPI’s high power flip chip LED for high/ low beam headlight sources module ZA9T-12G of Zeus series for example is a  module that provides over 2,450 lm (more than 305 lm/mm²) on a 5.74mm*1.4mm surface, making it very competitive with global leading manufacturers. Starting from 2015, the company entered the automotive lighting aftermarket with automotive lighting modules, and in 2016 GPI is collaborating with automotive lighting manufacturers to enter the original equipment automotive lighting supply chain.

(Author: Ivan Lin, Editor-in-Chief, Content Development Divions http://Translator: Emma Chang, Editor, LEDinside)