A review of 2013 LED products indicates package free products have been under the industry lime light for the whole year. The new trendsetter in the LED industry is not an innovative technology, LED manufacturers have already invested resources in package free LED R&D for several years. As the market becomes increasingly mature, there is no doubt that 2013 is a package free year. Many companies are hoping to enter this market including big international brands, such as Toshiba, Cree and Philips Lumileds. Other companies that have shown interest include Taiwanse LED chip manufacturers Epistar and Forepi, vertically integrated companies TSMC Solid State Lighting, Lextar, as well as package manufacturers, such as Unistars. Korean and Chinese manufacturers are also vying this market.

Package scaling. Traditional package migration path for semiconductor devices applied to LEDs shows that the CSP is the eventual end point. (Photo Courtesy of Philips Lumileds)

Philips Lumileds highlights CSP products

Chip Scale Package (CSP) technology has been under the spotlight in 2013. Although CSP technology has been applied by the semiconductor industry for several years, it is still considered as novel technology in the LED industry. In a recent tech article by Philips Lumileds, the company noted CSP technology development in the semiconductor industry was aimed at minimizing package size, improving heat dissipation, and improving chip reliability. These technology trends are also now moving towards the LED industry.

• For Further Reading: Philips Lumileds: Chip Scale Packaging for LEDs 

Philips Lumileds launches CSP LED chip LUXEON Q in Sept. 2013. ( LEDinside/Philips Lumileds)

Epistar reveals ELC technology to enter TV backlight

Taiwanese LED chip manufacturer Epistar’s latest package free Embedded LED Chip (ELC) also debuted in 2013. Epistar’s ELC product reduces lead frame and wire bonding processes, and only requires LED chip, phosphor powder and LED glue. The chip can be directly used with SMT. ELC applications will be prioritized in backlight products. ELC products also have the advantages of wider viewing angle. In the future, ELC will be taking on the challenge of omitting secondary optic lens to further cut costs.

• For Further Reading:  Epistar Unveils Package Free Chip Technology for LED-backlit TV

TSMC Solid State Lighting strategic partnership with a Xiamen company Topstar to develop new generation LED lighting products 

Taiwanese LED manufacturer TSMC Solid State Lighting is using its advanced PoD technology to develop new generation of LED bulb products with Topstar. The partnership is based on Topstar’s advantages in luminaire manufacturing and brand distribution, in combination with TSMC Solid State Lighting overall technological strengths. Through the partnership, the two companies hope to explore new business opportunities in the Chinese and global lighting market. Topstar is a well known lighting brand in China and has a history of manufacturing lighting products for 57 years. The company has strong distribution channels that have reached global scale.

• For Further Reading: TSMC and Xiamen Topstar Enter Strategic Cooperation Applying Package-Free PoD Modules

Unistars staggared array COB products. (LEDinside/ Unistars)

Unistars launches world’s smallest high power LED

Unistars is using more advanced Chip Scale Package (CSP) technology, and has launched its new Mercury 1515 series CSP products. The company is the first in Taiwan LED packager to mass produce CSP products. “Package free technology” has become the most popular LED technology in 2013, with many international companies releasing package free products at around the same time. Philips Lumileds has debuted LUXEON flip chip, LUXEON Q, Cree has highlighted XQ-E, while Unistars has announced mass production of package free technology Mercury 1515.

• For Further Reading: Unistars Mass Produces 1515 CSP LED Light Source

(Author: Pinchun Chou, Senior Editor, LEDinsidehttp:// Translator: Judy Lin, Editor, LEDinside)