It was just a few days ago when Japan-based LED maker, Toyota Gosei Co., Ltd., announced its plan to manufacture new LED products using gallium nitride substrates as base components. Measuring up to several hundred µms in thickness, these essential materials, once properly assembled with 1mmx1mm LED chips, provide potential brightness of up to 400 lumens, approximately three times the amount delivered by LEDs fabricated on sapphire substrates. As has been the case with the 8-inch, silicon-based wafer level packaging technology introduced a few years earlier, it is b...