2015-06-18

DEUTZ-FAHR Intros Industry-First LED Light Package for Its 7 Series Tractors

DEUTZ-FAHR in collaboration with HELLA has developed an industry-first LED light package for its award-winning line of 7 Series tractors.
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2015-06-16

Litecool Opens New LED Packaging Lab

Litecool (//www.litecool.co.uk), has opened a new clean room facility to research, develop, prototype and test new LED packaging technologies. The laboratory includes all the equipment needed to mount bare LEDs into packages, COBs and arrays. This will speed up time to market for new packaging technologies from Litecool.
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2015-06-10

Samsung Introduces COB LED Packages with Small LES and Advanced Color Quality

Samsung Electronics, a world leader in advanced component solutions, today introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.
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2015-06-10

EVERLIGHT Exhibits Diversified Lighting Packages at GILE 2015

Everlight Electronics, a leading player in the global LED and optoelectronics industry, will be introducing diversified LED packages at the Guangzhou International Lighting Exhibition 2015 (6/9-6/12, booth: 10.2 B02), including XI7070W, G9 package series, UV LED, automotive, sensing applications, Hong series with superior waterproof and UV resistant components for signage, brightness- and efficiency-enhanced LED package offering for a wide range of applications. EVERLIGHT is sincerely welcome you to experience EVERLIGHT one stop total solution at the show.
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2015-05-26

Osram’s Future LED Chip Strategy

LEDinside recently interviewed Louis Lam CEO of Osram Opto Semiconductors Asia about the company’s future LED product outlook for niche market applications, including IR LED, laser diodes, and the automotive lighting market and German government subsidies that are supporting industry developments.
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2015-05-25

TP LED Lighting LED Packaging Capacity in Thailand Reaches 8.64M per Month

TP LED Lighting’s in-house 2835 LED package production capacity is sufficient enough to meet the production of at least 60,000 LED T8 tube lights, said the company’s Director Howard Huang during an interview with LEDinside at LED Expo Thailand 2015, which took place from May 21-24, 2015 at IMPACT Exhibition and Convention Center.
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2015-05-08

Litecool Files PCB-Free LED Package Patent: “Lumen Block”™

Litecool (//www.litecool.co.uk), a innovator in LED packaging and thermal performance, announced today that it has filed a patent on a PCB-free LED package known as Lumen Block™. This new technology enables the assembly of LED arrays with no circuit board putting the LED package directly on the heat sink for ultimate thermal performance and cost reduction.
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2015-05-05

Nitride Semiconductors Focuses on UV LED Chip and Package Efficiency

Nitride Semiconductors, the second global leading UV LED manufacturer, displayed its LED package, chip and module designs at IR+UV EXPO 2015 this year, which took place recently at Pacifico Yokohama, Japan.
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2015-05-05

Samsung Electronics Introduces New Flip Chip LED Package with Wide Range of Operating Currents

Samsung Electronics, a world leader in advanced components, today introduced the LM301A, a flip-chip-based mid-power LED package that can operate at anywhere from 0.2 watts to 1 watt — providing a wide range of current options, resulting in much improved light efficacy. The package was announced at a press conference, in conjunction with LIGHTFAIR International 2015, being held in New York, May 5-7.
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2015-04-17

Yokowo Launches High Thermal Dissipation LTCC Substrates to Lower LED Package Costs

Japanese LED manufacturer Yokowo has launched Low Temperature Co-fired Ceramic (LTCC) Chip Scale Package (CSP) substrate to lower LED package costs, reported Nikkei recently.
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2015-02-24

Lumens to Introduce 200 l/w Flip-Chip Mid-Power Package

Lumens, a Korean LED packaging manufacturer, introduces new Mid-Power LED 5630F, a new family of ErgonTM.  Based on Lumens’ Flip Chip technology, the new 5630F4 provides the superb reliability to the conventional LED components while delivering the highest efficacy up to 200lumens-per-watt at 65mA, 5000K CCT, 80 CRI. Thanks to the world’s first silver-free flip chip technology, the new 5630F provides higher Reflectivity and Robustness. The 5630F also features high color uniformity with 3-step MacAdam Ellipses and Excellent light quality.
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2015-01-15

Daktronics Brings Light to Gillette Stadium Lettering with Freeform Elements

With a full regular season in the books, the New England Patriots are set to host a playoff game at Gillette Stadium in Foxborough, Massachusetts, a venue which showcases new freeform LED elements covering the "Gillette" lettering above the video displays at each end of the field from Daktronics (NASDAQ-DAKT) of Brookings, South Dakota. These two displays together create one of the largest freeform LED installations in a sports setting to use the puck-shaped technology.
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2014-12-25

Chinese LED Package Manufactures Restructure Situation in 2014

The Chinese LED package industry entered another production expansion peak in 2H14, with many large LED package manufacturers announcing production expansion plans.
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2014-12-24

2014 LED Market Recap: LED Chip and Package Supply and Demand Swings

One of the main LED industry indicators to look into in 2014 is manufacturers exponentially growing production volume. Where did this production capacity come from? Production capacity seen in 2014 mostly came from 2Q13 LED package expansions. A cloud of doom crept over the industry in 2012, as the industry’s oversupply situation triggered price wars and bankruptcy tsunami. Yet, in 2Q13 severe LED package shortages emerged as the slumping lighting market abruptly boomed. Many LED package manufacturers shared an optimistic market outlook at the time, some even doubled production capacity in a relatively short period.
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2014-12-18

Cree Launches Industry’s First Extreme High Power LEDs

Cree announces the commercial availability of XLamp® Extreme High Power (XHP) LEDs, a new class of LEDs that enable a system cost reduction of up to 40 percent for lighting applications. The first LEDs powered by Cree’s revolutionary SC5 Technology™ Platform, XLamp XHP50 and XHP70 LEDs provide twice the lumen output and improved reliability compared to previous LEDs of the same size. The groundbreaking technology of the new XHP LEDs will help drive the next major innovations in lighting system design.
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2014-12-16

Russian LED Lighting Industry Poised to Take Off

Will Russia become the next Pure Land for the LED industry? Or is it a market full of unknown risks? Could it be a paradise for foreign manufacturers? Or is it market full of threats? Out of potential emerging markets, LEDinside analysts have chosen the Russian market for “further studies”. Why not Southeast Asia, Middle East, or South America? What is so special about Russia that the LED lighting industry “should not” miss out?
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2014-12-16

Russian market introduction and trend analysis

In recent years, the LED lighting market has blossomed in emerging countries, and manufacturers’ development strategies in these markets have become increasingly important. This is mainly because in mature markets, such as Europe and Japan, global traditional luminaire brands still have the greatest market share. While in highly competitive countries, such as China where it appears profitable, many manufacturers have been unable to reap profits.
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2014-12-16

An Introduction to Russian LED Market

Will Russia become the next Pure Land for the LED industry? Or is it a market full of unknown risks? Could it be a paradise for foreign manufacturers? Or is it market full of threats? Out of potential emerging markets, LEDinside analysts have chosen the Russian market for “further studies”. Why not Southeast Asia, Middle East, or South America? What is so special about Russia that the LED lighting industry “should not” miss out?
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2014-12-12

Pixelligent Closes $5.5 Million in Funding

Pixelligent Technologies, producer of PixClear™, the leading nanocrystal dispersions for demanding applications in the Solid State Lighting and Optical Coatings & Films markets, announced today that it closed $5.5 million in new equity funding. The funds will be used to support its accelerating customer growth in Asia, the EU and the U.S., and also to hire application engineers, product managers, manufacturing engineers, and staff scientists.
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2014-12-11

MLS LED Package Business to Overtake Nichia

MLS has started to sell its products through Korean distributor Optoleds in Korea, according to a report by ETNews. MLS has become one of the first Chinese LED package manufacturers to be ranked among global top 10 LED manufacturers. A research organization estimated based on current development speed, MLS will be able to surpass top ranking Japanese LED manufacturer Nichia.
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2014-12-09

Seoul Semiconductor Projects Growing Acrich LED Demand

Seoul Semiconductor forecasted Acrich LED modules will provide a breakthrough in earnings as demands grow from overseas companies, according to a report from The Korea Times.
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2014-12-05

Honglitronic Maintains LED Package Gross Margin in 2014

Honglitronic’s LED package gross margin has stabilized with few fluctuations, according to the company’s latest financial report.
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2014-10-28

Bridgelux Launches New “Human Centric” Chip-on-Board LED Arrays

Bridgelux, a leading developer and manufacturer of LED lighting technologies, will debut its new Vero® Décor Series™ Class A Chip-on-Board (CoB) LED array products at the Hong Kong International Lighting Fair 2014. The launch of the Décor Series Class A arrays marks Bridgelux’s new “human-centric” approach to product development and color targeting by using Gamut Area Index (GAI) to measure how light and color appeals to and is perceived by the human brain.
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2014-10-27

LEDinside: LED Packaging Market to Expand just 3.2% in 2015

The LED packaging industry’s value is anticipated to only rise an estimated 3.2% on-year in 2015, from this year's US$14.6 billion to US$15 billion, according to the latest “Global LED package Industry Report” released by LEDinside, a division of Taiwan based market intelligence firm TrendForce. “With growth in the LED package market slowing and competitive pressure coming from China, the LED industry will face some major challenges next year,” said Roger Chu, research director at LEDinside. 
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2014-10-22

Samsung Electronics Announces 1W Mid-Power LED Package

Samsung Electronics has introduced the LM302A, a new 1W-level, high-luminance, mid-power LED package.
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2014-10-15

Alpha to Introduce New ALPHA® LED Materials Technologies at Strategies in Light

Alpha, the world leader in the production of electronic soldering materials, will introduce its new line of ALPHA® LED compatible materials technologies at Strategies in Light Exposition & Conference, Oct. 21-23, at the M.O.C. Event Center in Munich, Germany. These product technologies provide the needed performance and value across the LED lighting system manufacturing process from: Die Attach & Package, Package on Board, Luminaire Module, Power Driver/Supply and Control Systems.
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2014-10-09

Luminus Announces 5 Year Warranty on XNOVA Chip-On-Board LED Arrays

 Luminus Devices, Inc., a global manufacturer of high-performance LEDs and solid-state light sources, announced today a five year limited warranty for the XNOVA family of chip-on-board (COB) arrays designed for both indoor and outdoor directional lighting applications. The company introduces this warranty on the heels of competing their 6000 hour LM-80 testing which demonstrated long term color stability and robust lumen maintenance, even under extreme conditions including both high temperature and high drive current.
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2014-10-06

Advantek Expands LED Packaging with Acquisition of Tempo Electronics Surftape® Product Line

Advantek announced they have acquired all the assets of Tempo Electronics and the Surftape® product line. Effective immediately Advantek will be offering Surftape® through its extensive global sales organization.
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2014-10-02

ProLight Launches 3030 HV LED

As one of the leading Taiwan professional high power LED packaging house, ProLight Opto, have been devoted its R&D on developing the best AC-HV LED technology. We will showcase our high voltage (HV) LED in 3030 and 3535 package size at the 2014 HK International Lighting Fair.
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2014-09-25

Plessey Expands In-house LED Assembly Line at Plymouth Facility

Plessey today announced a further ambitious move to aligning its operations to its expanding Plymouth UK facility through the addition of an LED assembly line. The assembly line will enable Plessey to focus on its innovative high brightness LED growth plans based around its solid-state lighting and sensing business, taking new products from concept to production in less time whilst also functioning as an innovation center for the next generation of LED packages.
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ams OSRAM’s OSIRE® E3731i and Stand-Alone Intelligent Driver (SAID) use OSP license-free protocol to connect color LEDs, sensors and microcontrollers. ams OSRAM, a global leader in intelligent emitting and sensing technologies, will... READ MORE

JBD, a pioneering MicroLED display manufacturer, has set a new standard with its Phoenix series microdisplay, achieving an industry-record white-balanced brightness of 2 million nits. JBD’s Phoenix - Native Monolithic RGB Panel Leveragin... READ MORE